Hot encapsulated resin

PHENOFREE® Hot Mounting Resins

New phenol- and formaldehyde-free thermosetting assembly resin
In line with its ecological commitment, LAM PLAN offers the market the first effective alternative to phenolic metallographic assembly resins that are susceptible to phenol (and/or formaldehyde) release during baking.

The PHENOFREE assembly is intended for the technical assembly of all types of materials for material testing or edge testing. It intelligently replaces traditional phenol mounting resins with the same hardness and less shrinkage than phenol mounting resins.
The PHENOFREE range of resins includes resins in 3 colors (gray, white and red) to facilitate the identification of your metallographic samples. They are particularly suitable for polishing hard materials. Phenofree white resin can in some cases be a good alternative to the use of epoxy resins.

Hot mounting epoxy resins

The black epoxy mounting resin is filled with glass fibers with high mineral fillers. It is ideal for assemblies intended for edge testing of hard to extra hard materials due to its abrasion resistance, hardness and lack of shrinkage.

Hot mounting acrylic resins

The acrylic resin is perfectly transparent and adapts to most materials. It is mostly used to see the polishing progress on the part.

Copper hot mounting resins

Conductive resin encapsulation for SEM examinations or electrolytic polishing device. A pure copper-based resin with a very homogeneous consistency, the conductivity of its encapsulates is optimized. The use of ultrapure materials eliminates the risk of an error in the analysis.

Graphite hot assembly resins

Graphite-loaded phenolic conductive potting resin (without copper, metals or other alloys), suitable for SEM/TEM examination of samples.